P5 FULLY AUTOMATIC PROBING SYSTEM
2, 3, 4, 5, & 6- Inch Wafer, Waffle, Gel-Pak® & On-Tape Probing

PWS’ P5 Prober Systems are a family of fully automated production substrate handling systems that deliver high accuracy, high performance and high reliability probing.

All P5 probe systems come standard with a frictionless Air Bearing Motion System (ABMS) for X-Y positioning.  The ABMS is a lead-screw driven stage that moves on a friction-free film of air.  The stage is supported by air only during movement, and sits on a precision lapped surface at rest.  The ABMS is specifically designed for high precision micro stepping of semiconductor wafers and similar substrates.  The air bearing motion system, combined with PWS’ in-house manufactured lead screws, ensures superior accuracy, repeatability, and mechanical stability.

P5 systems are also equipped with ProbeCommander, PWS’ Real Time Wafer Mapping software.  ProbeCommander, a leading edge NT-based operating environment, significantly simplifies the test and production engineer’s tasks.  For example, bin result maps from production tests can be easily re-probed for failures.  An engineer can select and move to any tested bin: the moves can be either automatic step-and-repeat or under cursor/mouse control.  If needed, unique stepping patterns can be created to step within individual dies.  

ProbeCommander includes the following features:

• Wizard-guided steps

• Click-on-image setup navigation

• Browse and click lot-testing startup

• Vector, serpentine, and map major and minor stepping

• User defined, dynamically displayed colored maps and binning

PWS WELCOMES CUSTOM APPLICATIONS AND PROBER CONFIGURATIONS:

• Specially designed chucks and wafer handlers

• ProbeCommander API versions enable users to customize test applications

System Features:

• Automatic wafer load, unload and alignment

• Support plate for mounting probes, inspection optics, and/or custom hardware

• High-performance PC control system

• Gray scale pattern recognition system

• Programmable optics light source

• Real time wafer mapping system

• X-Y Microscope Translation (optional)

• Single die alignment software (optional)

• Optical character recognition (optional)

• Temperature controlled chuck (optional)

Prober Specifications:

• Stage travel:  (6.8 in. X) (10.5 in. Y)

• Theta rotation:  +/- 7.5 degrees

• Chuck planarization:  +/- 0.0005 inch

• Stage accuracy:  +/- 0.00025 inch

• Stage resolution:  0.0001 inch

• Scanning speed:*  5 inch / sec.

• Repeatability:  +/- 0.05 mils.

* Throughput, stepping or cycle time are not the same as “scanning speed”.  Stepping time varies with many factors and is highly dependent upon specific applications.  For specific data, please contact PWS engineering.